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Product Lifecycle Networking

At the end of September, customers and partners of the product lifecycle management (PLM) specialist ILC met in Heidelberg to jointly discuss the digital transformation of the product development process and share their experiences.
E-3 Magazine
November 1, 2016
[shutterstock:380661790, WeStudio]
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This text has been automatically translated from German to English.

At its Customer Experience Day 2016, ILC presented an intensive mix of expert presentations, live demos of industry-specific reference solutions and the opportunity for mutual exchange of experiences.

The first day of the conference was dominated by the expert presentations from the corporate practice of

  • Benteler Automotive
  • Diehl Aircabin
  • Rittal, Sartorius
  • Mahle Behr
  • Magna Automotive
  • and Aesculap

coined.

The focus was on the digitization of the product creation process, product structure and variant management, product master file, master data management, and test and validation management.

Here, participants had the opportunity to experience the potential and practical implementation of the holistic transformation of the product creation process enabled by ILC across PLM and ERP boundaries using real-life examples from the field.

At the numerous live demo points, there was the opportunity to clarify specific questions once again on the basis of the reference solutions.

Long-time ILC partner Prostep presented integration solutions from 4Pep and popular PLM systems such as Enova V6, Teamcenter UA and Windchill.

The second day focused on ILC's own developments. Here, industry-specific solutions in the areas of the automotive industry, medical technology and mechanical and plant engineering were demonstrated to the participants in three parallel slots.

Oliver Quirmbach, Managing Director of ILC:

"Product development processes can finally be mapped across system worlds. A quantum leap for transparent and efficient product development."

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Wednesday, May 21, and
Thursday, May 22, 2025

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Kurfürstenanlage 1
D-69115 Heidelberg

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The event is organized by the E3 magazine of the publishing house B4Bmedia.net AG. The presentations will be accompanied by an exhibition of selected SAP partners. The ticket price includes attendance at all presentations of the Steampunk and BTP Summit 2025, a visit to the exhibition area, participation in the evening event and catering during the official program. The lecture program and the list of exhibitors and sponsors (SAP partners) will be published on this website in due course.